Wafer grinding machine
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 21, 1997
Grant Date -
N/A
app pub date -
Oct 30, 1995
filing date -
Jul 14, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The wafer grinding machine uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.
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