Radiation sensitive resin composition
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United States of America Patent
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Oct 21, 1997
Grant Date -
N/A
app pub date -
Dec 2, 1994
filing date -
Dec 3, 1993
priority date (Note) -
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Abstract
A radiation sensitive resin composition which comprises (A) a polymer which becomes alkali-soluble in the presence of an acid and (B) a radiation sensitive acid generator which generates an acid upon irradiation with a radiation, said polymer (A) comprising two recurring units represented by the general formulas (1) and (2) and a recurring unit which acts to reduce the solubility of the polymer in an alkali developer after the irradiation: ##STR1## wherein R.sup.1 represents a hydrogen atom or a methyl group and R.sup.2 represents a hydrogen atom or a methyl group. Said composition provides a chemically amplified positive resist which can give a fine pattern with a good pattern shape, and said resist is freed from volume shrinkage, peeling failure and adhesive failure, is excellent in dry etching resistance and effectively reacts with various radiations to give a good pattern shape which is excellent in photolithographic process stability, said pattern shape having no thinned portion at the upper part.
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