Adjustable solder bump spacer for slider-suspension attachment
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United States of America Patent
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-
Oct 21, 1997
Grant Date -
N/A
app pub date -
Mar 19, 1996
filing date -
Mar 19, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A slider-suspension assembly for a data-recording disk file is provided having a spacer device separating the slider from the suspension. The spacer device includes one or more solder bumps having a height that is precisely controlled to provide the desired spacing. The spacing device prevents contact between the slider and the suspension.
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