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Abstract

Apparatus and method for metal line deposition on a substrate. Laser ablation of a metal film coated on a first substrate removes metal ions from the film. The ions travel forward to a surface of a second substrate disposed opposite the metal film on the first substrate and are deposited on the second substrate. A positive electrode on the first substrate, a negative electrode on the second substrate, and a power supply create an electric field that is simultaneously applied across the first and second substrates. The positively charged ions in the second substrate migrate toward the negative electrode of the electric field, leaving a surplus of negatively charged ions at the surface of the second substrate. The negative ions in the second substrate electrostatically bond with the positively charged ablated metal ions, thereby assisting the bonding of metal lines to the substrate. The power of the laser used during ablation and the position of a sample stage on which the second substrate is supported may be controlled by a computer to deposit metal line patterns on the second substrate.

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First Claim