A thin, deformable film or web is placed tightly against the surface of a rotary die having molding cavities. Dough is applied onto the film against the surface of the rotary die. Pressure is applied to the dough, deforming the film and forcing the film and dough to conform to the shape of the molding cavities. The film thus forms a barrier between the molding cavities of the rotary die and the dough, but allows any design details of the molding cavities to be transferred to the dough. The molded dough is easily extracted from the die cavities by removing the film and molded dough from the rotary die, and the film is easily removed from the molded dough.
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