Styrenic resin laminate and molding thereof
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United States of America Patent
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-
Nov 4, 1997
Issued Date -
N/A
app pub date -
Apr 29, 1996
filing date -
Mar 30, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There are disclosed a styrenic resin laminate comprising at least one surface layer consisting essentially of a styrenic polymer having a high degree of syndiotactic configuration (SPS layer) and a foam layer (other layer) consisting essentially of a styrenic resin (GPPS, IPS, HIPS, ABS resin, SMA copolymer, AS resin, modified PPO; blend of HIPS/PPO, etc); and a molding obtained by thermoforming the above-mentioned laminate. The above laminate is particularly excellent in heat resistance and easily thermoformable into the molding, which is also excellent in heat resistance and recyclability in terms of retention of flexural strength, utilizable in heating oil-base food with a microwave range and can easily be recovered for reuse, thereby greatly contributing to environmental preservation and resources saving.
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