Wafer-scale techniques for fabrication of semiconductor chip assemblies
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United States of America Patent
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Nov 11, 1997
Grant Date -
N/A
app pub date -
Oct 7, 1994
filing date -
Sep 24, 1990
priority date (Note) -
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Abstract
Semiconductor chip assemblies are fabricated by assembling flexible, sheetlike elements bearing terminals to a wafer, connecting the terminals of each sheetlike element to contacts on the chip, and subsequently severing the chips from the wafer to provide individual assemblies. Each assembly includes a sheetlike element and a chip, arranged so that the terminals on the flexible element.
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