Process for making a Z-axis adhesive and establishing electrical interconnection therewith
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United States of America Patent
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Nov 11, 1997
Grant Date -
N/A
app pub date -
Mar 10, 1995
filing date -
Mar 10, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A Z-axis adhesive is produced by dispersing electrically-conductive particles in an organic binder and then imagewise exposing the material to electromagnetic radiation, preferably from a laser or a flash lamp, under conditions sufficient to transfer the particles from the binder to a receptor in a patterned fashion such that the resulting adhesive is a Z-axis conductor in the patterned areas. The patterned adhesive can then be used to establish electrical interconnection between facing electrodes of a number of different structures including semiconductor chips and a flexible printed circuit board.
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