Ceramic substrate with thin-film capacitor and method of producing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5685968
SERIAL NO

08540969

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Abstract

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In a ceramic substrate with a thin-film capacitor, having a ceramic substrate a lower electrode layer formed on the ceramic substrate, a dielectric layer formed on the lower electrode layer and made of an oxide of a material constituting the lower electrode layer, and an upper electrode layer formed on the dielectric layer, a plating layer is provided between the ceramic base and the lower electrode layer to serve as a basis for the lower electrode layer.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NGK SPARK PLUG CO., LTD.AICHI1358

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hayakawa, Toshitaka Nagoya, JP 2 35
Takada, Toshikatsu Nagoya, JP 12 196
Yoshida, Shinobu Nagoya, JP 21 291

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Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
6339527 Thin film capacitor on ceramic 23 1999
 
JU SUNGENGINEERING CO., LTD. (1)
* 6180542 Method for forming a high-permittivity dielectric film use in a semiconductor device 14 1999
 
ALPS ELECTRIC CO., LTD. (3)
* 6556421 Temperature-compensating thin-film capacitor and electronic device 5 2001
* 6777778 Thin-film resistor and method for manufacturing the same 2 2002
* 2002/0197,811 Thin-film resistor and method for manufacturing the same 9 2002
 
MICRON TECHNOLOGY, INC. (4)
* 6660610 Devices having improved capacitance and methods of their fabrication 1 1996
6838353 Devices having improved capacitance and methods of their fabrication 2 1999
7205599 Devices having improved capacitance 0 1999
* 7126205 Devices having improved capacitance and methods of their fabrication 1 2004
 
JAPAN SCIENCE AND TECHNOLOGY AGENCY (2)
* 6878666 Photocatalyst made of metal oxynitride having responsibility of visible light 13 2002
* 2002/0151,434 Photocatalyst mede of metal oxynitride having responsive to visible light 2 2002
 
BLACKBERRY LIMITED (2)
* 7224040 Multi-level thin film capacitor on a ceramic substrate 25 2004
* 2005/0117,272 Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same 1 2004
 
SAMSUNG ELECTRONICS CO., LTD. (1)
* 6596149 Manufacturing method for capacitor having electrode formed by electroplating 6 1999
 
MURATA MANUFACTURING CO., LTD. (1)
* 6935002 Method of manufacturing a nonreciprocal circuit device 0 2000
 
MITSUI MINING & SMELTING CO., LTD. (2)
* 7524552 Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer 4 2003
* 2006/0057,420 Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such such copper foil with dielectric layer, and method for producing such copper foil with dielectric layer for formation of capacitor layer 3 2003
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (2)
* 6498714 Thin film capacitance device and printed circuit board 29 2000
6678144 Capacitor, circuit board with built-in capacitor and method for producing the same 29 2002
 
UNITED MICROELECTRONICS CORP. (1)
* 6200629 Method of manufacturing multi-layer metal capacitor 18 1999
 
Ultrasource, Inc. (9)
6761963 Integrated thin film capacitor/inductor/interconnect system and method 21 2001
6998696 Integrated thin film capacitor/inductor/interconnect system and method 8 2003
6890629 Integrated thin film capacitor/inductor/interconnect system and method 10 2003
7327582 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2005/0175,938 Integrated thin film capacitor/inductor/interconnect system and method 3 2005
7425877 Lange coupler system and method 1 2005
* 2005/0162,236 Lange coupler system and method 2 2005
7446388 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2006/0097,344 Integrated thin film capacitor/inductor/interconnect system and method 0 2005
 
INTEL CORPORATION (3)
* 6048445 Method of forming a metal line utilizing electroplating 19 1998
* 6631540 Method of forming a low inductance high capacitance capacitor 5 2000
6905925 Method of forming a low inductance high capacitance capacitor 4 2003
 
HYNIX SEMICONDUCTOR INC. (2)
* 6680228 Capacitor in semiconductor device 1 2002
* 2003/0039,091 Capacitor in semiconductor device 0 2002
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (1)
* 6316307 Method of forming a capacitor for a semiconductor memory device 3 2000
 
VISHAY SPRAGUE, INC. (2)
* 7208218 Method of suppressing the oxidation characteristics of nickel 0 2005
* 2006/0039,821 Method of suppressing the oxidation characteristics of nickel 0 2005
* Cited By Examiner