Method for laser functional trimming of films and devices

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United States of America Patent

PATENT NO 5685995
SERIAL NO

08538073

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Abstract

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A laser system (50) and processing method exploit a wavelength range (40) in which devices, including any semiconductor material-based devices (10) affected by conventional laser wavelengths and devices having light-sensitive or photo-electronic portions integrated into their circuits, can be effectively functionally trimmed without inducing performance drift or malfunctions in the processed devices. True measurement values of operational parameters of the devices can, therefore, be obtained without delay for device recovery, i.e., can be obtained substantially instantaneously with laser impingement. Accordingly, the present invention allows faster functional laser processing, eases geometric restrictions on circuit design, and facilitates production of denser and smaller devices.

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Patent Owner(s)

  • ELECTRO SCIENTIFIC INDUSTRIES, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sun, Yunlong Portland, OR 73 1924
Swenson, Edward J Portland, OR 36 780

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