Integrated circuit package with permanent identification of device characteristics and method for adding the same
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United States of America Patent
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Nov 11, 1997
Grant Date -
N/A
app pub date -
Sep 29, 1995
filing date -
Sep 29, 1995
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An integrated circuit (IC) device package that includes permanent identification regarding the device characteristics, wherein the permanent identification are at or below the surface of the package and may indicate the operating frequency of an IC die within the package, as well as voltage requirements, etc.
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