Method of forming polysilicon having a desired surface roughness

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United States of America Patent

PATENT NO 5688550
SERIAL NO

08572968

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Abstract

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A method for reliably forming polysilicon of a desired surface roughness includes providing a layer of doped or undoped amorphous silicon on a substrate and heating said substrate while monitoring the emission of said substrate and comparing the monitored emission with an expected emission attributable to the heating regime employed. An increase in the monitored emission not attributable to the heating regime signals a transition of the layer of amorphous silicon to rough polysilicon. A decrease in the monitored emission not attributable to the heating regime signals a transition to smooth polysilicon. The increases and decreases in the monitored emission can be used to end the heating regime at the time at which the desired surface roughness of polysilicon is formed, or merely to passively monitor the process.

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Patent Owner(s)

Patent OwnerAddress
MICRON TEHNOLOGY INC8000 SOUTH FEDERAL WAY BOISE ID 83707

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kepten, Avishai Beit H'Cerem, IL 19 556
Sendler, Michael Migdal Ha'emek, IL 8 303
Weimer, Ronald A Boise, ID 113 2880

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