Multilayer electronic circuit having a conductive adhesive
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United States of America Patent
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Nov 18, 1997
Grant Date -
N/A
app pub date -
Sep 27, 1995
filing date -
Jun 10, 1988
priority date (Note) -
In Force
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Abstract
A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
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