Integrated thin-film terminations for high temperature superconducting microwave components

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5693595
SERIAL NO

08471063

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A termination for a high-temperature superconductive thin-film microwave device formed on the obverse side of a substrate with the reverse side of the substrate having a ground plane. The termination can include a thin-film resistor being integral with an operative component, with the substrate being a preselected dielectric substrate. The resistor can have an epitaxially-formed layer of molybdenum metal of a first preselected thickness on the obverse side, and an epitaxially-formed layer of titanium metal of a second preselected thickness thereon. The termination includes a epitaxially-formed thin-film capacitor integral with the resistor. The capacitor can have a layer of titanium metal formed on a portion of the obverse side with a layer of gold metal formed thereon. The substrate can be lanthanum aluminate, and the high-temperature superconductive film can be a yttrium-barium-copper-oxide film. The ground plane can be made of a high-temperature superconductive film and annealed gold.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NORTHROP GRUMMAN CORPORATIONLOS ANGELES, CA100

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Meier, Daniel L Forest Hills, PA 20 477
Talisa, Salvador H Edgewood, PA 6 63

Cited Art Landscape

Patent Info (Count) # Cites Year
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
* 5488253 Semiconductor device 12 1994
 
SUMITOMO ELECTRIC INDUSTRIES, LTD. (1)
* 5219827 Microwave resonator having a ground conductor partially composed of oxide superconductor material 19 1991
 
FUJITSU LIMITED (1)
* 5455064 Process for fabricating a substrate with thin film capacitor and insulating plug 33 1993
 
NORTHROP GRUMMAN CORPORATION (1)
* 5021867 Refractory resistors with etch stop for superconductor integrated circuits 18 1989
 
BELL TELEPHONE LABORATORIES, INCORPORATED (1)
* 4837609 Semiconductor devices having superconducting interconnects 68 1987
 
EATON CORPORATION (1)
* 4876176 Method for fabricating quasi-monolithic integrated circuits 14 1987
* Cited By Examiner

Patent Citation Ranking

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LENOVO PC INTERNATIONAL (1)
* 6046652 Loading element for EMI prevention within an enclosure 9 1997
 
INTEGRATED DEVICE TECHNOLOGY, INC. (1)
6600384 Impedance-compensating circuit 9 2001
 
Ultrasource, Inc. (9)
6761963 Integrated thin film capacitor/inductor/interconnect system and method 21 2001
6998696 Integrated thin film capacitor/inductor/interconnect system and method 8 2003
6890629 Integrated thin film capacitor/inductor/interconnect system and method 10 2003
7327582 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2005/0175,938 Integrated thin film capacitor/inductor/interconnect system and method 3 2005
7425877 Lange coupler system and method 1 2005
* 2005/0162,236 Lange coupler system and method 2 2005
7446388 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2006/0097,344 Integrated thin film capacitor/inductor/interconnect system and method 0 2005
 
ANOKIWAVE, INC. (1)
* 6924714 High power termination for radio frequency (RF) circuits 7 2003
 
MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC. (1)
* 6114716 Heterolithic microwave integrated circuits 8 1997
* Cited By Examiner