Micromachined device packaged to reduce stiction
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United States of America Patent
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-
Dec 9, 1997
Grant Date -
N/A
app pub date -
Mar 15, 1996
filing date -
Mar 15, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A micromachined device is packaged to reduce stiction. In one embodiment, a level of moisture is introduced in the package to create a very thin film over surfaces of the device. The device can also be packaged with a vapor deposition of an organic material after a wafer of devices has been separated into individual dies and the individual dies are placed in open containers. In another embodiment, a micromachined device is positioned in an open package and a liquid or solid organic material is disposed within the package so that when the device is sealed, the organic material vaporizes and coats portions of the die to reduce stiction.
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