Non-photolithographic etch mask for submicron features
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United States of America Patent
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Dec 9, 1997
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N/A
app pub date -
Mar 7, 1996
filing date -
Mar 7, 1996
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Abstract
A non-photolithographic, physical patterning process, which is useful for selectively etching of a substrate, is provided. The process comprises electrostatically charging liquid droplets which are selectively etchable with respect to the substrate, dispersing the droplets onto substrate in a pattern; and etching the substrate using the droplets as a mask.
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