Abrasive particle, method for producing the same, and method of use of the same
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United States of America Patent
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Dec 16, 1997
Grant Date -
N/A
app pub date -
May 22, 1996
filing date -
May 22, 1995
priority date (Note) -
Expired
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Abstract
Disclosed is an abrasive particle having an average particle size of not more than 2 .mu.m and comprising 100 parts by weight of aluminum oxide and/or silicon oxide and 5 to 25 parts by weight of cerium in the form of cerium oxide. A method for producing the same, and a method for planarizing an insulating film on a semiconductor substrate using the abrasive particles are also disclosed.
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