Integrated electro-optical package with carrier ring and method of fabrication
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 16, 1997
Grant Date -
N/A
app pub date -
Mar 4, 1996
filing date -
Mar 4, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated electro-optical package (40) including an optically transparent substrate (10) with an array (15) of light emitting devices (LEDs) (12) formed thereon, cooperating to generate a complete image, thereby forming a LED display chip (14). The LEDs (12) are positioned in rows and columns and having electrical connections adjacent outer edges of the substrate (10). A driver board (30), having embedded electrical conductors (34), plated through-hole vias (44) and/or embedded leadframes (45) for cooperating with the LEDs (12) of the LED display chip (14) and further having a plurality of driver and control circuits (42) connected to the driver board (30) and LEDs (12). A molded carrier ring (50), electrically interfaced with the driver board (30), the LED display chip (14) and the driver and control circuits (42). A molded refractive or diffractive lens (60) positioned in alignment with the array (15) of LEDs (12) of the LED display chip (14) and on a side opposite the mounting of the LED display chip (14), thereby capable of magnifying the image and producing an easily viewable virtual image.
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