Thick-film capacitor and chip-type composite electronic component utilizing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5699224
SERIAL NO

08735996

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Disclosed are a thick-film capacitor and a chip-type composite electronic component. A pair of end electrodes are formed on the insulator substrate. A lower electrode is formed on the insulator substrate. A dielectric layer is formed on the lower electrode. An upper electrode formed on the dielectric layer. One of the lower electrode and the upper electrode has a broad-width portion having a width wider than the remaining portion thereof. The one of the lower and upper electrode at the broad-width portion is directly connected to one of the end electrodes. The thick-film capacitor is provided with a capacitor electrode arranged to provide positive connection, even where the width of the capacitor electrode is determined narrow to meet a small capacitance value.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
ROHM CO., LTD.KYOTO3183

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hanamura, Toshihiro Kyoto, JP 18 149
Tanimura, Masanori Kyoto, JP 9 62

Cited Art Landscape

Patent Info (Count) # Cites Year
 
ALPS ELECTRIC CO., LTD. (2)
* 4476518 Thick film electronic circuit 7 1982
* 4561039 Thick film electronic circuit 13 1984
 
KABUSHIKI KAISHA TOSHIBA (1)
* 4572843 Method for producing a capacitor with precise capacitance 32 1985
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
Barry Industries, Inc. (2)
* 6759919 Low intermodulation film microwave termination 0 2003
* 2003/0117,225 Low intermodulation film microwave termination 0 2003
 
Ultrasource, Inc. (9)
6761963 Integrated thin film capacitor/inductor/interconnect system and method 21 2001
6998696 Integrated thin film capacitor/inductor/interconnect system and method 8 2003
6890629 Integrated thin film capacitor/inductor/interconnect system and method 10 2003
7327582 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2005/0175,938 Integrated thin film capacitor/inductor/interconnect system and method 3 2005
7425877 Lange coupler system and method 1 2005
* 2005/0162,236 Lange coupler system and method 2 2005
7446388 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2006/0097,344 Integrated thin film capacitor/inductor/interconnect system and method 0 2005
 
CHEMTRON RESEARCH LLC (3)
* 7436678 Capacitive/resistive devices and printed wiring boards incorporating such devices and methods of making thereof 1 2004
* 7382627 Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof 5 2004
* 2006/0082,981 Capacitive/resistive devices and printed wiring boards incorporating such devices and methods of making thereof 0 2004
 
ROHM CO., LTD. (1)
* 6128199 Composite device and manufacturing method thereof 7 1998
 
TAIYO YUDEN CO., LTD. (1)
* 8209829 Method of fabricating the electronic device 1 2009
* Cited By Examiner