Thick-film capacitor and chip-type composite electronic component utilizing the same

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United States of America Patent

PATENT NO 5699224
SERIAL NO

08735996

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed are a thick-film capacitor and a chip-type composite electronic component. A pair of end electrodes are formed on the insulator substrate. A lower electrode is formed on the insulator substrate. A dielectric layer is formed on the lower electrode. An upper electrode formed on the dielectric layer. One of the lower electrode and the upper electrode has a broad-width portion having a width wider than the remaining portion thereof. The one of the lower and upper electrode at the broad-width portion is directly connected to one of the end electrodes. The thick-film capacitor is provided with a capacitor electrode arranged to provide positive connection, even where the width of the capacitor electrode is determined narrow to meet a small capacitance value.

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Patent Owner(s)

Patent OwnerAddress
ROHM CO LTD21 SAIIN MIZOSAKI-CHO UKYO-KU KYOTO-SHI KYOTO 615-8585

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hanamura, Toshihiro Kyoto, JP 18 150
Tanimura, Masanori Kyoto, JP 9 76

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