Universal QFP tray transfer method
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United States of America Patent
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-
Dec 23, 1997
Issued Date -
N/A
app pub date -
Jul 9, 1996
filing date -
Jun 15, 1993
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An improved method for transferring a semiconductor carrier tray is disclosed. The method herein provides for transferring a semiconductor carrier tray from a first location to a second location by first positioning a cap member to cover the mouth of at least one cup of a semiconductor carrier tray. The capping member contacts the uppermost surface of the cup wall. A partial vacuum is applied to the capped cup, and atmosphere is evacuated from the capped cup, adhering the semiconductor tray to the capping member. Movement of the capping member causes movement of the carrier tray from a first location to a second location. When the carrier tray has been positioned at its final destination, the vacuum is released causing separation of the carrier tray and the capping member. A vacuum cap apparatus is also disclosed.
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