Substrate processing method and substrate processing apparatus

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United States of America Patent

PATENT NO 5700127
SERIAL NO

08667712

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Abstract

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According to the present invention, a substrate processing method has (a) the step of predetermining initial conditions for cassettes and substrates before processing is started, (b) the step of setting the cassettes in which the substrates are stored, in the loading/unloading section on the basis of the initial conditions, (c) the step of detecting the states of the cassettes set in the loading/unloading section and checking, on the basis of the detection results, whether the cassettes are set in the states set in the step (a), (d) the step of displaying the states of the cassettes when it is determined in the step (c) that the state of at least one cassette is not the state set in the step (a), (e) the step of resetting the cassette in the state set in the step (a) on the basis of the display in the step (d), (f) the step of detecting the substrates which are present in the cassettes set in the loading/unloading section and obtaining mapping data on the basis of the detection results, (g) the step of selecting a substrate from the cassettes in the loading/unloading section on the basis of the mapping data and the initial conditions, (h) the step of extracting the selected substrate from the cassettes, conveying the substrate to a processing section, and processing the substrate according to the initial conditions, and (i) the step of storing the processed substrate in a cassette set in the loading/unloading section.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325 ?1076325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harada, Ichiro Kumamoto, JP 16 233
Harada, Junji Kumamoto, JP 22 234
Nakamura, Koji Kumamoto, JP 269 3092

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