System for real-time control of semiconductor wafer polishing
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United States of America Patent
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Dec 23, 1997
Issued Date -
N/A
app pub date -
Oct 24, 1995
filing date -
Aug 25, 1993
priority date (Note) -
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Abstract
A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.
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