Hermetically sealed package for a high power hybrid circuit
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United States of America Patent
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-
Dec 23, 1997
Grant Date -
N/A
app pub date -
Aug 2, 1994
filing date -
Aug 2, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A metal ring frame, having co-fired ceramic inserts, is hermetically sealed to a copper/molybdenum base using a brazing alloy having a melting temperature which is approximately the cross-over temperature for the TCE curves of the base and ring frame. Preferably the base contains at least 20% copper by weight. The brazing alloy is a silver/copper alloy such as 56% Ag, 22% Cu, 17% Zn and 5% Sn, or one with a higher brazing temperature such as 78/22 Ag/Cu, and is used for brazing both the inserts into the frame and the frame onto the base.
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