Arrangement for inductive signal transmission between the chip layers of a vertically integrated circuit
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United States of America Patent
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Dec 23, 1997
Grant Date -
N/A
app pub date -
Oct 27, 1995
filing date -
Nov 15, 1994
priority date (Note) -
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Abstract
In an arrangement for signal transmission between chip layers of a vertically integrated circuit, a defined, inductive signal transmission ensues between a part of the vertically integrated circuit in one chip layer and a further part of the vertically integrated circuit in a further chip layer by means of a coupling inductance formed by respective coils in the two layers. Particularly given high connection densities, a large number of freely placeable and reliable vertical signal connections can be produced directly from the inside of one chip layer to the inside of a neighboring chip layer without extremely high demands being made on the adjustment of the chip layers relative to one another and on the surface planarity of the individual chip layers.
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