Apparatus for testing flip chip or wire bond integrated circuits
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United States of America Patent
Stats
-
Dec 23, 1997
Grant Date -
N/A
app pub date -
Jul 5, 1995
filing date -
Jul 5, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus for use in testing wire bond or flip chip connected integrated circuits includes a housing with a top side, a bottom side, and a perimeter region defining a housing central aperture. The housing further includes flip chip pads to accommodate flip chip solder connections to a flip chip integrated circuit during a first test period and wire bond pads to accommodate wire bond connections to a wire bond integrated circuit during a second test period. There are connector pins on the bottom side of the housing for connection with a printed circuit board. The printed circuit board includes an access aperture which is aligned with the housing central aperture. This configuration allows a test probe to access a flip chip integrated circuit positioned within the housing. It also allows a heat sink to be used when the housing incorporates a wire bonded integrated circuit.
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