Heat flow transducer
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United States of America Patent
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-
Dec 30, 1997
Grant Date -
N/A
app pub date -
Aug 9, 1994
filing date -
Aug 9, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A heat flow transducer comprises one or more thermoelectric cooler (TEC) devices mounted in a core of heat resistant material which is subjected to the heat flow to be measured. Multiple TECs are thermally in parallel and electrically in series.
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