Ultra low profile board-mounted modular jack
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United States of America Patent
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Dec 30, 1997
Grant Date -
N/A
app pub date -
Aug 30, 1996
filing date -
Aug 30, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
A modular jack (10) mountable to a circuit board (12), with a bottom section (50) of a housing (32) forwardly of solder tails (38) of contacts (36) thereof, being disposed within a recess (52) in the circuit board, whereby the height of the top surface of the jack above the circuit board is minimized without reducing the size of the plug-receiving cavity (30) of the jack.
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Cited Art Landscape
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