Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
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United States of America Patent
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Dec 30, 1997
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N/A
app pub date -
Oct 19, 1994
filing date -
Jun 26, 1992
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Abstract
A method for achieving a hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein. Use of an ultra-thin integrated circuit chip die, thin ceramic housing layers and external lead frame allow an ultra-thin overall package that may be used singularly or further densely packaged into a three dimensional multi-package array and still meet the critical performance and reliability requirements for both military and aerospace applications.
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