Wafer holder for semiconductor applications
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 30, 1997
Grant Date -
N/A
app pub date -
Oct 25, 1995
filing date -
Oct 25, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor substrate (15) is placed into a recessed area (12) of a support structure (10). A ring (20) is then placed on the support structure (10) to form a wafer holder (30) which provides support to the semiconductor substrate (15) during handling, transporting, or electrical testing operations. The recessed area (12) can also have a vacuum opening (13) and a vacuum groove (17) so a vacuum pressure can be applied to the backside of semiconductor substrate (15). This will correct for any warpage or bowing in the semiconductor substrate (15) so a planar surface is formed for the electrical testing operation. The wafer holder (30) also has a flat (16) so the wafer holder (30) can be aligned and processed like a wafer with a diameter larger than the semiconductor substrate (15).
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