Importance

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Abstract

Semiconductor substrates are held by a substrate holder having a parallel arrangement of bridges, and are capable of being dipped in processing liquids by the holder. Each bridge has an alternate arrangement of teeth and valleys to define Y-shaped notches. Vent holes are formed in the bottoms of the notches for ready drainage of processing liquids. The substrates are held in the notches while contacting only the walls of the notches. Thus, there is minimum contact between the substrates and the substrate holder. When the holder is lifted up from the processing liquid, part of the processing liquid remaining around the contacts between the substrates and the valleys drain through the vent holes, which attributes to the rapid drying of the substrates.

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First Claim