Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet
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United States of America Patent
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Jan 6, 1998
Grant Date -
N/A
app pub date -
Nov 28, 1995
filing date -
Nov 29, 1994
priority date (Note) -
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Abstract
The present invention disposes an easily releasing layer on a surface intended for dicing tape sticking of a dicing ring frame to thereby enable preventing the transfer of an adhesive substance to the ring frame for use in semiconductor wafer working, reducing the frequency of cleaning of the ring frame to the requisite minimum and prolonging the life of the ring frame.
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