Process for treatment of materials with diode radiation
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United States of America Patent
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Jan 6, 1998
Grant Date -
N/A
app pub date -
Nov 17, 1995
filing date -
May 19, 1993
priority date (Note) -
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Abstract
The invention relates to a process for material treatment with diode radiation, especially laser diode radiation. To match the radiation profile to the treatment process, the process is so carried out that radiation emitted from a multiplicity of diodes is directed with a predetermined radiation profile upon the treated region of the workpiece and that a change in the intensity distribution in the radiation profile is effected by controlling the diode output power.
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