Non-contact IC card and process for its production

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United States of America Patent

PATENT NO 5705852
SERIAL NO

08629565

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Abstract

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In a non-contact IC card comprising a substrate and provided thereon at least an IC chip and an antenna coil formed by etching, a connecting terminal of the antenna coil and a connecting bump of the IC chip are interconnected in a face-down fashion via an anisotropic conductive adhesive layer, or interconnected by wire bonding.

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Patent Owner(s)

Patent OwnerAddress
SONY CHEMICAL CORP6-3 NIHONBASHIMUROMACHI 1-CHOME CHUOU-KU TOKYO 103-8312

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujimoto, Masahiro Kanuma, JP 55 1214
Kurita, Hideyuki Kanuma, JP 25 258
Monkawa, Haruo Kanuma, JP 1 99
Orihara, Katsuhisa Kanuma, JP 46 1026

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