Method of making a circuitized substrate using two different metallization processes
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United States of America Patent
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Jan 13, 1998
Grant Date -
N/A
app pub date -
Dec 1, 1995
filing date -
Dec 1, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for making a circuitized substrate is defined wherein the substrate is treated with two different, e.g., additive and subtractive, metallization processes. The process is thus able to effectively produce substrates including conductive features, e.g., high density circuit lines and chip heat-sinking pads, of two different degrees of resolution in a cost effective and expeditious manner. The resulting product is also defined.
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