Automatic switching-off structure for protecting electronic device from burning
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United States of America Patent
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Jan 13, 1998
Grant Date -
N/A
app pub date -
Jul 18, 1996
filing date -
Jul 18, 1996
priority date (Note) -
Expired
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Abstract
An electronic device integrally formed with an automatic switching-off structure for protecting the device from overheating. At least one conducting lead of the electronic device is mechanically and electrically connected to its corresponding electrode by means of a solder column having desired melting point, with an appropriate spacing being kept between the conducting lead and the electrode. The coating layer of the electronic device is formed by a material such as epoxy resin which will soften and release a gaseous substance when heated to a temperature near its ignition point. When the temperature of the device exceeds the melting point of the solder, the solder column melts to break the electrical circuit and prevent overheating of the device. If the electronic device per se has higher working temperature, the coating layer is formed by a material having a higher ignition point such as silicon resin or silicon rubber which will not soften and expand when heated to a temperature near its ignition point. In this case, a compressed spring is interposed between the conducting lead and the electrode, and the coating layer must include, in the part enwrapping the solder column, a breakage or a weak portion which is apt to break upon suffering a tensile force in the direction generally parallel to the solder column.
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Hung, Je | No. 12, Lane 11, Sec. 1, Yon-An North Rd., San-Chung City, Taipei Hsien, TW | 1 | 82 |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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