Apparatus and method for automatic monitoring and control of stencil printing
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United States of America Patent
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Jan 20, 1998
Grant Date -
N/A
app pub date -
Jan 28, 1997
filing date -
Jan 28, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A stencil printing apparatus (100) is provided for printing a solder paste (108), through apertures (104) in a stencil (102), onto metallized portions of a printed circuit substrate (106). The printing apparatus contains a laser surface profiling device (114) which is used to produce 2- and 3-dimensional profiles of a portion of the surface of solder paste adjacent to a squeegee (110). Data is processed and sent to a controller (118) which is coupled to a solder paste dispenser (112). The controller automatically signals the dispenser (112) to dispense additional solder paste at deficient locations as needed.
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