Importance

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Abstract

The present invention addresses the need to effectively heat seal various polymeric materials to each other. The invention is particularly useful in solving the problems associated with sealing dissimilar materials together. A bonded polymer structure and method for preparing the structure are provided. The bonded polymer structure comprises a first polymeric panel, a second polymeric panel, and a one layer adhesive or two layer adhesive structure which binds them together. The two layer adhesive structure comprises a tie layer and a sealant layer disposed between the first polymeric panel and the second polymeric panel, the tie layer contacting the first polymeric panel and the sealant layer, and the sealant layer contacting the layer and the inner side of the second polymeric panel. A closure arrangement may be integrally formed with the first polymeric panel. The first polymeric panel may consist of such compounds as polyethylene, polypropylene, copolymers of polyethylene and polypropylene, and physical mixtures thereof. The second polymeric panel may consist of such compounds as polyethylene, polypropylene and mixtures thereof, polyester, and polystyrene. An appropriate adhesive is utilized to seal the two panels depending on the composition of the second panel.

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First Claim