Adhesive composition curable upon exposure to radiation and applications therefor
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United States of America Patent
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Jan 20, 1998
Grant Date -
N/A
app pub date -
Oct 16, 1996
filing date -
Jun 30, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An adhesive composition, a laminated structure, and a method of laminating a structure. The adhesive composition comprises an admixture of unsaturated polymerizable material and a photoreactor, the photoreactor comprising a wavelength-specific sensitizer covalently bonded to a reactive species-generating photoinitiator. Suitable wavelength-specific sensitizers have a molar extinction coefficient greater than about 5000 liters per mole per cm at an absorption maximum and resulting photoreactors have a quantum yield of greater than about 0.5 at an absorption maximum. Suitable photoreactors include 2-?p-(2-methyllactoyl)phenoxy!ethyl-1,3-dioxo-2-isoindolineacetate, 2-hydroxy-2-methyl-4'-?2-?p-(3-oxobutyl)phenoxy!ethoxy!propiophenone, 4-?p-?(4-benzoylcyclohexyl)oxy!phenyl!-2-butanone, and 1,3-dioxo-2-isoindolineacetic acid diester with 2-hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone. The laminated structure includes at least two layers bonded together with the adhesive composition, in which at least one layer is a cellulosic or polyolefin nonwoven web or film. The laminated structure is made by irradiating the adhesive composition to cure the adhesive composition.
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