Printed wiring board with photoimageable dielectric base substrate and method of manufacture therefor
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United States of America Patent
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Jan 20, 1998
Grant Date -
N/A
app pub date -
Oct 21, 1994
filing date -
Oct 21, 1994
priority date (Note) -
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Abstract
A printed wiring board includes a photoimageable dielectric material (PID) utilized as the base dielectric substrate therefor. The photoimageable dielectric material may be utilized in many conventional PWB designs, and improved resolution and registration precision of access apertures and through holes is generally realized through the use thereof. Moreover, less costly and complex manufacturing processes are required to deposit, image, develop and cure the PID material.
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