Importance

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Abstract

A semiconductor package has high reliability and a simple structure and configuration, can be removed as a function section performing the main data processing, substantially improves retainability and portability, and is connected to external equipment without the need of contact. The semiconductor package comprises a circuit board on one main side of which has a region in which IC chips can be mounted, ac IC chip mounted in said region on the surface of the circuit board, a shield resin layer that buries or covers at least part of the mounted IC chip, at least one loop-like antenna pattern integrally formed in a region of the main side other than the region in which the IC chip is mounted for transmitting and receiving signals without the need of contact, and an antenna pattern for power induction located independently of said antenna pattern and inducing power electromagnetically. According to this semiconductor package, the antenna pattern for transmission and reception is also used to cause electromagnetic induction, and the induced power is used to drive the IC chip. This allows drive power batteries or external power connection terminals to be omitted, thereby substantially simplifying the handling of this package. Since this also obviates the need of the space for installing these power batteries and external power connection terminals, the package can be more compact.

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First Claim