Epoxy adhesives with dithiooxamide adhesion promoters
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United States of America Patent
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Jan 27, 1998
Grant Date -
N/A
app pub date -
Apr 11, 1995
filing date -
Apr 11, 1995
priority date (Note) -
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Abstract
The invention provides a curable, structural epoxy adhesive composition comprising: (a) an epoxy resin; (b) a curing agent for the epoxy resin; and (c) a compound of the formula I: ##STR1## in which R.sup.1 and R.sup.2, which may be the same or different, are selected from an alkyl group, a hydroxyalkyl group, a cycloalkyl group, an aryl group, an arylalkyl group, or a heterocyclic group in which the one to three non-carbon atoms in the ring are independently selected from S, N, and O.
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