Method of manufacturing a semiconductor device suitable for surface mounting
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United States of America Patent
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Jan 27, 1998
Grant Date -
N/A
app pub date -
May 13, 1996
filing date -
May 12, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing a semiconductor device suitable for surface mounting whereby semiconductor elements are interconnected into a coherent row of semiconductor elements by means of conductive strips such that a connection point of a certain semiconductor element is connected to a connection point of a semiconductor element preceding it in the row by means of a strip, and another connection point of said certain semiconductor element is connected to a connection point of a semiconductor element following it in the row, and the row of semiconductor elements is enveloped in a protective material, and the semiconductor elements are mutually separated into individual semiconductor devices provided with two side faces, each side face having a portion of the strip which is processed into a connection conductor in that an electrically conducting layer is provided on the side faces contacting said portion of the strip.
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