Integrated circuit assembly having a stepped interposer and method
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United States of America Patent
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Feb 3, 1998
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N/A
app pub date -
Mar 21, 1996
filing date -
Mar 21, 1996
priority date (Note) -
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Abstract
A method of forming an integrated circuit assembly having a stepped interposer (300), an integrated circuit die (200) and an encapsulant (500). The stepped interposer (300) includes a central portion (320) having a plurality of contact regions (360), and a peripheral region (330), completely surrounding the central region (320), having a plurality of bonding regions (350). Some of the contact regions (360) are electrically coupled to some of the bonding regions (350). The integrated circuit die (200) includes a plurality of bonding pads (210) located around its periphery. The stepped interposer (300) is fixably coupled to the integrated circuit die (200) and some of the bonding pads (210) are electrically coupled to some of the bonding regions (350). The stepped interposer (300) of the present invention provides contact regions (360) free from encapsulant (500) and added protection for wirebonds (400) or any other means of electrical coupling.
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