High-density electronic module
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United States of America Patent
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Feb 3, 1998
Grant Date -
N/A
app pub date -
Mar 31, 1994
filing date -
Jun 18, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A highly dense electronic module for installation into a computer or other electronic device comprises at least one wafer or wafer section and means for connection with the electronic device. With an embodiment comprising plural wafer sections, the wafer sections are mechanically joined and electrically coupled.
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