Multi-layer, multi-chip pyramid and circuit board structure
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United States of America Patent
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Feb 3, 1998
Grant Date -
N/A
app pub date -
May 24, 1996
filing date -
Dec 30, 1994
priority date (Note) -
Expired
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Abstract
The present invention provides multi-layer multi-chip circuit board comprising at least two ATAB carriers having chips thereon, stacked upon each other in a pyramid configuration and attached to a substrate, thus reducing the required area on the substrate for mounting components to form a circuit board.
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