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Abstract

A package containing a vapor phase corrosion inhibitor for use in forming film packaging envelopes. The package, and the method of forming the package include the selection of a suitable substrate board, and the application of a thermally activated adhesive film containing a quantity of vapor phase corrosion inhibitor onto the surface of the board. The films are thermal forming resins, such as a copolymer of ethylene and a vinyl monomer having an acid group thereon, and with the film resin also being blended with a vapor phase corrosion inhibitor. The vapor phase corrosion inhibitors used in the adhesive and in the film are selected from the group consisting of blends of alkali metal molybdates, alkali metal nitrites, triazoles, and amine salts. In forming the package, the films are initially heated or formed separately, and thereafter moved into contact with the substrate, this being undertaken with the peripheral areas of the film thereby becoming bonded to the substrate.

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