Method of arranging alignment marks
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United States of America Patent
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Feb 10, 1998
Grant Date -
N/A
app pub date -
Dec 4, 1996
filing date -
May 29, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
A shot region includes a device region for forming a semiconductor device therein and a dicing region used for dicing. A portion of the peripheral edge portion of the shot region is defined by a portion of the peripheral edge portion of the device region. An alignment mark is arranged within the device region, and additional alignment marks are arranged within the dicing region. Thus, the number of the devices manufactured per wafer can be increased without degrading precision of alignment.
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