Solder-ball connected semiconductor device with a recessed chip mounting area
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United States of America Patent
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-
Feb 10, 1998
Grant Date -
N/A
app pub date -
Dec 2, 1996
filing date -
Jul 25, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device which remains highly reliable and is easy to mount even when a bonding pad pitch is reduced. The semiconductor device is featured in that a thermally conductive support substrate in which a semiconductor chip is fixed to a recessed portion is mounted on the reverse side of an insulating tape, that is, a TAB substrate having a conductor pattern on the surface; and solder balls are placed on the front side of the insulating tape to ensure connection to the conductor pattern on the front side through holes.
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