Printed-wiring board having plural parallel-connected interconnections

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United States of America Patent

PATENT NO 5717556
SERIAL NO

08638939

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In a printed-wiring board, first and second hard substrates each having electronic components mounted thereon are connected through a flexible substrate interposed therebetween. A circuit pattern printed on each of the hard and flexible substrates electrically connects the electronic components mounted on the hard substrates through the flexible substrate. The circuit pattern includes a plurality of parallel-connected signal lines. The parallel-connected signal lines are spatially separated on the flexible substrate, and the both ends of the parallel-connected signal lines are located in the hard substrates, respectively. A single signal line of the circuit pattern branches on one hard substrate into the parallel-connected signal lines, which extend through the flexible substrate and are converged to a single signal line on the other hard substrate.

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Patent Owner(s)

Patent OwnerAddress
NEC CORPORATIONTOKYO 108-8001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yanagida, Keiichirou Tokyo, JP 3 147

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