Thermosetting resin transfer molding process

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United States of America Patent

PATENT NO 5718864
SERIAL NO

08418568

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Abstract

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A method of resin transfer molding with a thermoset resin material and including the steps of forming a mold defining a cavity, communicating a hollow sprue with the mold cavity, filling the mold cavity and the sprue with unpolymerized resin and catalyst mixture under pressure, refrigerating the sprue adjacent to the mold cavity so as to delay polymerization of the resin in the sprue to maintain a pressure path through the sprue to the mold cavity during the continued application of pressurized mixture to the sprue, and maintaining the refrigerating of the mixture in the sprue until after at least commencement of polymerization of the resin in the mold cavity to form a molded part.

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Patent Owner(s)

Patent OwnerAddress
BRP US INC10101 SCIENCE DRIVE STURTEVANT WI 53177

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bailey, Francis V Racine, WI 13 90

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